In a vacuum compartment newly produced wafers are cooled down. A handler is used to move the wafers
around the compartment allowing new wafers to come in and transporting cooled wafers out of the
compartment. The cooling rate is the limiting factor and influences the logistics of wafer handling.
The prediction of the cooling rate (radiation controlled) depends on optical properties and the geometry
of the device. The optical properties might also be be temperature dependent.
A jet pump, sometimes referred to as vaccuum pump, entrails material out of a container by
utilizing the jet momentum.
The nozzle design must establish a certain pressure distribution precisely in order to ensure
the required entraillment rate.
The pictures provided here show the geometry and the pressure distribution within the pump.